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NCP3011, NCV3011
ABSOLUTE MAXIMUM RATINGS (measured vs. GND pin 8, unless otherwise noted)
High Side Drive Boost Pin
Boost to V SW differential voltage
COMP
Enable
Feedback
High ? Side Driver Output
Low ? Side Driver Output
Power Good
Synchronization
Main Supply Voltage Input
External Reference
Switch Node Voltage
Rating
Symbol
BST
BST ? V SW
COMP
EN
FB
HSDR
LSDR
PG
SYNC
V CC
VREF
V SW
V MAX
45
13.2
5.5
5.5
5.5
40
13.2
5.5
5.5
40
5.5
40
V MIN
? 0.3
? 0.3
? 0.3
? 0.3
? 0.3
? 0.3
? 0.3
? 0.3
? 0.3
? 0.3
? 0.3
? 0.6
Unit
V
V
V
V
V
V
V
V
V
V
V
V
Maximum Average Current
V CC , BST, HSDRV, LSDRV, V SW , GND
REF
EN
SYNC
PG
Operating Junction Temperature Range (Note 1)
Maximum Junction Temperature
Storage Temperature Range
Thermal Characteristics (Note 2)
TSSOP ? 14 Plastic Package
Thermal Resistance Junction ? to ? Air
Lead Temperature Soldering (10 sec): Reflow (SMD styles only) Pb ? Free
(Note 3)
I max
T J
T J(MAX)
T stg
R q JA
R F
130
7.1
2.5
11
4
? 40 to +140
+150
? 55 to +150
190
260 Peak
mA
° C
° C
° C
° C/W
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum package power dissipation limit must not be exceeded.
P D +
T J(max) * T A
R q JA
2. When mounted on minimum recommended FR ? 4 or G ? 10 board
3. 60 ? 180 seconds minimum above 237 ° C.
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